Semiconductor device and radio frequency module formed on high resistivity substrate

ABSTRACT

A semiconductor device includes a high resistivity substrate, a transistor formed on the high resistivity substrate, and a deep trench device isolation region formed in the high resistivity substrate to surround the transistor. Particularly, the high resistivity substrate has a first conductive type, and a deep well region having a second conductive type is formed in the high resistivity substrate. Further, a low concentration well region having the first conductive type is formed on the deep well region, and the transistor is formed on the low concentration well region.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority to Korean Patent Application No.10-2015-0086371, filed on Jun. 18, 2015 and all the benefits accruingtherefrom under 35 U.S.C. § 119, the contents of which are incorporatedby reference in their entirety.

TECHNICAL FIELD

The present disclosure relates to a semiconductor device and a radiofrequency (RF) module formed on a high resistivity substrate, and moreparticularly, to a semiconductor device formed on a high resistivitysilicon substrate and an RF module including the same.

BACKGROUND

An RF module such as an RF front-end module (FEM) may be incorporatedinto various types of wireless devices, including mobile phones, smartphones, notebooks, tablet PCs, PDAs, electronic gaming devices,multi-media systems, and the like. The RF module may include an RFactive device, an RF passive device, an RF switching device and acontrol device.

The RF switching device may be generally manufactured on a SOI (siliconon insulator) substrate to reduce RF noise coupling, and the RF modulemay have a SIP/MCM (single in-line package/multi-chip module) structureincluding the RF switching device, the RF active device, the RF passivedevice and the control device.

However, there is a limit in reducing the manufacturing cost of the RFFEM due to the relatively high price of the SOI substrate and the costof the SIP/MCM process.

SUMMARY

The present disclosure describes a semiconductor device formed on a highresistivity substrate and an RF module including the same.

In accordance with an aspect of the claimed invention, a semiconductordevice may include a high resistivity substrate having a firstconductive type, a deep well region having a second conductive type andformed in the high resistivity substrate, a low concentration wellregion having the first conductive type and formed on the deep wellregion, a transistor formed on the low concentration well region, and adeep trench device isolation region formed in the high resistivitysubstrate to surround the transistor.

In accordance with some exemplary embodiments, the semiconductor devicemay further include a shallow trench device isolation region formed onthe deep trench device isolation region.

In accordance with some exemplary embodiments, the transistor mayinclude a gate structure formed on the low concentration well region,source and drain regions formed at surface portions of the lowconcentration well region adjacent to both sides of the gate structure,respectively, and a high concentration impurity region formed on oneside of the source region.

In accordance with some exemplary embodiments, the source region mayhave the second conductive type, the high concentration impurity regionmay have the first conductive type, and the source region and the highconcentration impurity region may be electrically connected with eachother.

In accordance with some exemplary embodiments, the low concentrationwell region may have an impurity concentration in a range of about 1E+10to about 1E+12 ions/cm².

In accordance with some exemplary embodiments, the deep well region andthe low concentration well region may be formed inside the deep trenchdevice isolation region, and the deep trench device isolation region maybe formed deeper than the deep well region.

In accordance with some exemplary embodiments, a second well regionhaving the first conductive type may be formed outside the deep trenchdevice isolation region, and a second high concentration impurity regionhaving the first conductive type may be formed on the second wellregion.

In accordance with some exemplary embodiments, the deep well region maybe formed wider than the low concentration well region, and the deeptrench device isolation region may be formed deeper than the deep wellregion to pass through the deep well region.

In accordance with some exemplary embodiments, a second well regionhaving the second conductive type may be formed outside the deep trenchdevice isolation region, and a second high concentration impurity regionhaving the second conductive type may be formed on the second wellregion.

In accordance with some exemplary embodiments, the deep trench deviceisolation region may have a slit to electrically connect the deep wellregion with the second well region.

In accordance with some exemplary embodiments, a third well regionhaving the first conductive type may be formed outside the second wellregion.

In accordance with some exemplary embodiments, the semiconductor devicemay further include a second device isolation region formed to surroundthe second well region and the second high concentration impurityregion. The second device isolation region may include a second deeptrench device isolation region and a second shallow trench deviceisolation region formed on the second deep trench device isolationregion.

In accordance with some exemplary embodiments, a third well regionhaving the first conductive type may be formed outside the second deviceisolation region.

In accordance with some exemplary embodiments, a surface portion of thehigh resistivity substrate may be used as the low concentration wellregion.

In accordance with another aspect of the claimed invention, asemiconductor device may include a high resistivity substrate having afirst conductive type, a deep well region having a second conductivetype and formed in the high resistivity substrate, a low concentrationwell region having the first conductive type and formed on the deep wellregion, a plurality of transistors formed on the low concentration wellregion and disposed in a multi-finger structure in which the pluralityof transistors is electrically connected with one another, and a deeptrench device isolation region having a ring shape to surround theplurality of transistors and formed deeper than the deep well region.

In accordance with some exemplary embodiments, the low concentrationwell region may have an impurity concentration in a range of about 1E+10to about 1E+12 ions/cm².

In accordance with some exemplary embodiments, a high concentrationimpurity region having the first conductive type may be formed betweensource regions of transistors disposed adjacent with each other amongthe plurality of transistors, and the high concentration impurity regionand the source regions of the adjacent transistors may be electricallyconnected with one another.

In accordance with some exemplary embodiments, a second well regionhaving the second conductive type may be formed outside the deep trenchdevice isolation region, a second high concentration impurity regionhaving the second conductive type may be formed on the second wellregion, and the deep trench device isolation region may have a slit toelectrically connect the deep well region with the second well region.

In accordance with some exemplary embodiments, a second deep trenchdevice isolation region may be formed outside the second well region, athird well region having the first conductive type may be formed outsidethe second deep trench device isolation region, and a third highconcentration impurity region having the first conductive type may beformed on the third well region.

In accordance with still another aspect of the claimed invention, aradio frequency (RF) module may include an RF switching device formed ona high resistivity substrate, an RF active device formed on the highresistivity substrate, an RF passive device formed on the highresistivity substrate, and a control device formed on the highresistivity substrate. Particularly, the RF switching device may includea deep well region having a second conductive type and formed in thehigh resistivity substrate, a low concentration well region having afirst conductive type and formed on the deep well region, a transistorformed on the low concentration well region, and a deep trench deviceisolation region formed in the high resistivity substrate to surroundthe transistor.

The above summary of the invention is not intended to describe eachillustrated embodiment or every implementation of the present invention.The detailed description and claims that follow more particularlyexemplify these embodiments.

BRIEF DESCRIPTION OF THE DRAWINGS

Exemplary embodiments can be understood in more detail from thefollowing description taken in conjunction with the accompanyingdrawings, in which:

FIG. 1 is a cross-sectional view illustrating a semiconductor device inaccordance with a first exemplary embodiment of the claimed invention;

FIG. 2 is a plan view illustrating a semiconductor device in accordancewith a second exemplary embodiment of the claimed invention;

FIG. 3 is a cross-sectional view taken along line III-III′ as shown inFIG. 2;

FIG. 4 is a cross-sectional view taken along line IV-IV′ as shown inFIG. 2;

FIG. 5 is a plan view illustrating a semiconductor device in accordancewith a third exemplary embodiment of the claimed invention;

FIG. 6 is a cross-sectional view taken along line VI-VI′ as shown inFIG. 5;

FIG. 7 is a cross-sectional view taken along line VII-VII′ as shown inFIG. 5;

FIG. 8 is a cross-sectional view illustrating a semiconductor device inaccordance with a fourth exemplary embodiment of the claimed invention;

FIG. 9 is a cross-sectional view illustrating a semiconductor device inaccordance with a fifth exemplary embodiment of the claimed invention;

FIG. 10 is a cross-sectional view illustrating a semiconductor device inaccordance with a sixth exemplary embodiment of the claimed invention;and

FIG. 11 is a schematic view illustrating an RF module formed on a highresistivity substrate.

While embodiments are amenable to various modifications and alternativeforms, specifics thereof have been shown by way of example in thedrawings and will be described in detail. It should be understood,however, that the intention is not to limit the invention to theparticular embodiments described. On the contrary, the intention is tocover all modifications, equivalents, and alternatives falling withinthe spirit and scope of the invention as defined by the appended claims.

DETAILED DESCRIPTION OF EMBODIMENTS

Hereinafter, specific embodiments will be described in more detail withreference to the accompanying drawings. The claimed invention may,however, be embodied in different forms and should not be construed aslimited to the embodiments set forth herein.

As an explicit definition used in this application, when a layer, afilm, a region or a plate is referred to as being ‘on’ another one, itcan be directly on the other one, or one or more intervening layers,films, regions or plates may also be present. Unlike this, it will alsobe understood that when a layer, a film, a region or a plate is referredto as being ‘directly on’ another one, it is directly on the other one,and one or more intervening layers, films, regions or plates do notexist. Also, though terms like a first, a second, and a third are usedto describe various components, compositions, regions and layers invarious embodiments of the claimed invention are not limited to theseterms.

Furthermore, and solely for convenience of description, elements may bereferred to as “above” or “below” one another. It will be understoodthat such description refers to the orientation shown in the Figurebeing described, and that in various uses and alternative embodimentsthese elements could be rotated or transposed in alternativearrangements and configurations.

In the following description, the technical terms are used only forexplaining specific embodiments while not limiting the scope of theclaimed invention. Unless otherwise defined herein, all the terms usedherein, which include technical or scientific terms, may have the samemeaning that is generally understood by those skilled in the art.

The depicted embodiments are described with reference to schematicdiagrams of some embodiments of the claimed invention. Accordingly,changes in the shapes of the diagrams, for example, changes inmanufacturing techniques and/or allowable errors, are expected.Embodiments of the claimed invention are not described as being limitedto specific shapes of areas described with diagrams and includedeviations in the shapes. The areas described with drawings likewise areentirely schematic and their shapes do not represent exact shapes, butrather the claimed invention is intended to include components ofvarious other sizes, shapes, and details that would be understood tothose of ordinary skill in the art.

FIG. 1 is a cross-sectional view illustrating a semiconductor device inaccordance with a first exemplary embodiment of the claimed invention.

Referring to FIG. 1, a semiconductor device 100, in accordance with afirst exemplary embodiment of the claimed invention, may be used tomanufacture an RF module such as an RF FEM. The RF FEM may beincorporated into various types of wireless devices, including mobilephones, smart phones, notebooks, tablet PCs, PDAs, electronic gamingdevices, multi-media systems, and the like. The semiconductor device 100may be used as an RF switching device of the RF FEM.

The semiconductor device 100 may include a transistor 110 such as afield effect transistor (FET) formed on a high resistivity substrate102. The high resistivity substrate 102 may be formed of silicon (Si)and have a first conductive type, for example, P-type.

For example, the high resistivity substrate 102 may be lightly dopedwith a P-type impurity, for example, boron, indium, or combinationsthereof and may have a relatively high resistivity higher than about 100ohm·cm. Particularly, the high resistivity substrate 102 may have a highresistivity of about 1,000 ohm·cm to about 20,000 ohm·cm.

As shown in FIG. 1, though one transistor 110 is formed on the highresistivity substrate 102, a plurality of transistors may be formed onan active region of the high resistivity substrate 102.

In accordance with the first exemplary embodiment, the semiconductordevice 100 may include a device isolation region 120 configured tosurround the transistor 110. Particularly, the device isolation region120 may have a ring shape to, in combination with high resistivitysubstrate 102, electrically surround the transistor 110. Deviceisolation region 120 may include a deep trench device isolation (DTI)region 122 and a shallow trench device isolation (STI) region 124. TheSTI region 124 may be formed on the DTI region 122, in embodiments.

A depth of the DTI region 122 may be greater than about 5 μm.Particularly, a depth of the DTI region 122 may be in a range of about 5μm to about 10 μm. The DTI region 122 may used to reduce an RF noisecoupling and improve electrical characteristics of an RF passive deviceadjacent to the semiconductor device 100.

To form the DTI region 122, a deep trench may be formed by a deepreactive ion etching (DRIE) process and an oxide liner (not shown) maybe formed on inner surfaces of the deep trench by a thermal oxidationprocess. Then, the deep trench may be filled up with un-dopedpoly-silicon thereby forming the DTI region 122. Meanwhile, a shallowtrench may be formed at a surface portion of the high resistivitysubstrate 102 and may then be filled up with silicon oxide therebyforming the STI region 124.

The transistor 110 may include a gate structure 112 formed on the highresistivity substrate 102 and source and drain regions 114 and 116formed at surface portions of the high resistivity substrate 102adjacent to both sides of the gate structure 112, respectively. Thesource and drain regions 114 and 116 may be doped with an impurityhaving a second conductive type. For example, the source and drainregions 114 and 116 may be doped with an N-type impurity such asphosphorus, arsenic, or combinations thereof. The gate structure 112 mayinclude a gate insulating layer formed on the high resistivity substrate102, a gate electrode formed on the gate insulating layer and a spacerformed on side surfaces of the gate electrode.

A low concentration well region 132 having the first conductive type,i.e., P-type, may be formed under the transistor 110, and a deep wellregion having the second conductive type, i.e., N-type, 130 may beformed under the low concentration well region 132. For example, a deepN-type well (DNW) region 130 may be formed in the high resistivitysubstrate 102, and a low concentration P-type well (LPW) region 132 maybe formed on the DNW region 130. The transistor 110 may be formed on theLPW region 132.

The DNW region 130 and the LPW region 132 may be formed inside the DTIregion 122. The DTI region 122 may extend deeper (that is, further awayfrom transistor 110) than the DNW region 130, in embodiments. Thus, theRF noise coupling of the semiconductor device 100 may be significantlyreduced, and the electrical characteristics of the RF passive deviceadjacent to the semiconductor device 100 may be significantly improvedby the DTI region 122. Further, a junction capacitance between the DNWregion 130 and the high resistivity substrate 102 may be significantlyreduced.

Particularly, the LPW region 132 may be used to reduce off-statecapacitance (Coff) and on-state resistance (Ron) of the semiconductordevice 100. In detail, depletion regions between the source and drainregions 114 and 116 and the LPW region 132 may sufficiently extend suchthat the Coff and Ron of the semiconductor device 100 are significantlyreduced. As a result, the RF switch performance of the semiconductordevice 100 may be sufficiently improved.

For example, the LPW region 132 may have an impurity concentration in arange of about 1E+10 to about 1E+12 ions/cm². Alternatively, though notshown in figures, a first P-type well (PW) region may be formed betweenthe DNW region 130 and the LPW region 132 in other embodiments. In suchcase, it is desirable that the LPW region 132 may have an impurityconcentration lower than that of the first PW region to facilitateproper current flow.

Further, the LPW region 132 may be an un-implanted region. That is, asurface portion of the high resistivity substrate 102 may be used as theLPW region 132.

In accordance with the first exemplary embodiment, a high concentrationimpurity region 140 having the first conductive type, i.e., P-type, maybe formed on one side of the source region 114, which may be used as asubstrate tab or a well tab. The high concentration impurity region 140may be electrically connected with the source region 114. The highconcentration impurity region 140 may be used to improve a sourcecontact and reduce a voltage drop of the semiconductor device 100.

Meanwhile, a second well region having the first conductive type, forexample, a second P-type well (PW) region 134, may be formed outside thedevice isolation region 120, and a second high concentration impurityregion 142 having the first conductive type, i.e., P-type, may be formedon the second PW region 134. The second high concentration impurityregion 142 may be used to apply a PW bias voltage to the highresistivity substrate 102.

FIG. 2 is a plan view illustrating a semiconductor device in accordancewith a second exemplary embodiment of the claimed invention, FIG. 3 is across-sectional view taken along line III-III′ as shown in FIG. 2, andFIG. 4 is a cross-sectional view taken along line IV-IV′ as shown inFIG. 2.

Referring to FIGS. 2 to 4, a semiconductor device 200, in accordancewith a second exemplary embodiment of the claimed invention, may includea plurality of transistors 210 formed on a high resistivity substrate202. A DNW region 230 may be formed in the high resistivity substrate202, and an LPW region 232 may be formed on the DNW region 230.

The transistors 210 may be formed on the LPW region 232. Each of thetransistors 210 may include a gate structure 212 formed on the LPWregion 232 and source and drain regions 214 and 216 formed at surfaceportions of the LPW region 232 adjacent to both sides of the gatestructure 212, respectively, and a P-type high concentration impurityregion 240 may be formed on one side of the source region 214. The gatestructure 212 may include a gate insulating layer formed on the LPWregion 232, a gate electrode formed on the gate insulating layer and aspacer formed on side surfaces of the gate electrode.

In accordance with the second exemplary embodiment, the semiconductordevice 200 may include a device isolation region 220 configured tosurround an active region on which the transistors 210 are formed. Thedevice isolation region 220 may include a DTI region 222 formed deeperthan the DNW region 230 and a STI region 224 formed on the DTI region222.

An N-type well (NW) region 234 may be formed outside the deviceisolation region 220, and an N-type high concentration impurity region242 may be formed on the NW region 234.

Particularly, the LPW region 232 may be formed inside the deviceisolation region 220, and the DNW region 230 may be formed wider thanthe LPW region 232. The DTI region 222 may pass through the DNW region230 and extend deeper than the DNW region 230 (i.e., extend further fromthe surface having transistor 210 as shown in FIG. 4). The NW region 234may be formed on an edge portion of the DNW region 230 (i.e., closer tothe surface holding transistor 210, and also arranged to extend furtheralong the plane parallel that same surface).

In accordance with the second exemplary embodiment, the NW region 234may be electrically connected with the edge portion of the DNW region230, and the DTI region 222 may have a slit 226 to electrically connectthe DNW region 230 with the NW region 234. The slit 226 may be used toapply an NW bias voltage or a reverse bias voltage to the DNW region 230through the N-type high concentration impurity region 242 and the NWregion 234. For example, a width of the slit 226 may be in a range ofabout 1 μm to about 2 μm.

Thus, a depletion region between the LPW region 232 and the DNW region230 and a depletion region between the DNW region 230 and the highresistivity substrate 202 may extend, and a junction capacitance betweenthe LPW region 232 and the DNW region 230 and a junction capacitancebetween the DNW region 230 and the high resistivity substrate 202 may besignificantly reduced. As a result, an RF noise coupling of thesemiconductor device 200 and a leakage current through the highresistivity substrate 202 may be significantly reduced.

Particularly, depletion regions between the source and drain regions 214and 216 and the LPW region 232 may sufficiently extend such that theCoff and Ron of the semiconductor device 200 may be significantlyreduced. As a result, the RF switch performance of the semiconductordevice 200 may be significantly improved.

For example, the LPW region 232 may have an impurity concentration in arange of about 1E+10 to about 1E+12 ions/cm². Alternatively, though notshown in figures, a first P-type well (PW) region may be formed betweenthe DNW region 230 and the LPW region 232. In such case, it is desirablethat the LPW region 232 may have an impurity concentration lower thanthat of the first PW region.

Further, the LPW region 232 may be an un-implanted region. That is, asurface portion of the high resistivity substrate 202 may be used as theLPW region 232.

Meanwhile, a second PW region 236 may be formed outside the NW region234, and a second P-type high concentration impurity region 244 may beformed on the second PW region 236. The second P-type high concentrationimpurity region 244 may be used to apply a PW bias voltage to the highresistivity substrate 202, and the second PW region 236 may be used toreduce or prevent a depletion region from extending between the NWregion 234 and the high resistivity substrate 202. Further, a second STIregion 250 may be formed between the N-type high concentration impurityregion 242 and the second P-type high concentration impurity region 244.

FIG. 5 is a plan view illustrating a semiconductor device in accordancewith a third exemplary embodiment of the claimed invention, FIG. 6 is across-sectional view taken along line VI-VI′ as shown in FIG. 5, andFIG. 7 is a cross-sectional view taken along line VII-VII′ as shown inFIG. 5.

Referring to FIGS. 5 to 7, a semiconductor device 300, in accordancewith a third exemplary embodiment of the claimed invention, may includea plurality of transistors 310 formed on a high resistivity substrate302. A DNW region 330 may be formed in the high resistivity substrate302, and an LPW region 332 may be formed on the DNW region 330.

The transistors 310 may be formed on the LPW region 332. Each of thetransistors 310 may include a gate structure 312 formed on the LPWregion 332 and source and drain regions 314 and 316 formed at surfaceportions of the LPW region 332 adjacent to both sides of the gatestructure 312, respectively, and a P-type high concentration impurityregion 340 may be formed on one side of the source region 314. The gatestructure 312 may include a gate insulating layer formed on the LPWregion 332, a gate electrode formed on the gate insulating layer and aspacer formed on side surfaces of the gate electrode.

In accordance with the third exemplary embodiment, the semiconductordevice 300 may include a first device isolation region 320 configured tosurround an active region on which the transistors 310 are formed. Thefirst device isolation region 320 may include a first DTI region 322formed deeper than (i.e., extending further away from the surface uponwhich transistors 310 are arranged) the DNW region 330 and a first STIregion 324 formed on the first DTI region 322.

An NW region 334 may be formed outside the first device isolation region320, and an N-type high concentration impurity region 342 may be formedon the NW region 334.

The LPW region 332 may be formed inside the first device isolationregion 320, and the DNW region 330 may be formed wider than the LPWregion 332 (i.e., DNW region 330 extends further along a plane parallelthe surface upon which transistors 310 are built than does LPW region332). The first DTI region 322 may pass through the DNW region 330 andextend deeper than the DNW region 330. The NW region 334 may be formedon an edge portion of the DNW region 330 to have a ring shape.

In accordance with the third exemplary embodiment, the NW region 334 maybe electrically connected with the edge portion of the DNW region 330,and the first DTI region 322 may have a slit 326 to electrically connectthe DNW region 330 with the NW region 334. The slit 326 may be used toapply an NW bias voltage or a reverse bias voltage to the DNW region 330through the N-type high concentration impurity region 342 and the NWregion 334. For example, a width of the slit 326 may be in a range ofabout 1 μm to about 2 μm.

Particularly, a second device isolation region 350 may be formed outsidethe NW region 334, which may have a ring shape to surround the NW region334 and the N-type high concentration impurity region 342. The seconddevice isolation region 350 may include a second DTI region 352 and asecond STI region 354 formed on the second DTI region 352. For example,a depth of the second DTI region 352 may be greater than about 5 μm.Particularly, a depth of the second DTI region 352 may be in a range ofabout 5 μm to about 10 μm.

The second device isolation region 350 may be used to reduce or preventa depletion region from extending between the DNW region 330, the NWregion 334 and the high resistivity substrate 302. Further, the seconddevice isolation region 350 may be used to electrically isolate thesemiconductor device 300 from a control device adjacent thereto.

Meanwhile, a second PW region 336 may be formed outside the seconddevice isolation region 350, and a second P-type high concentrationimpurity region 344 may be formed on the second PW region 336. Thesecond P-type high concentration impurity region 344 may be used toapply a PW bias voltage to the high resistivity substrate 302.

FIG. 8 is a cross-sectional view illustrating a semiconductor device inaccordance with a fourth exemplary embodiment of the claimed invention.

Referring to FIG. 8, a semiconductor device 400, in accordance with afourth exemplary embodiment, may include a plurality of transistors 410formed on a high resistivity substrate 402. Particularly, thesemiconductor device 400 may have a multi-finger structure in which thetransistors 410 are electrically connected with one another.

A DNW region 430 may be formed in the high resistivity substrate 402,and an LPW region 432 may be formed on the DNW region 430. Thetransistors 410 may be formed on the LPW region 432. Each of thetransistors 410 may include a gate structure 412 formed on the LPWregion 432 and source and drain regions 414 and 416 formed at surfaceportions of the LPW region 432 adjacent to both sides of the gatestructure 412, respectively. The gate structure 412 may include a gateinsulating layer formed on the LPW region 432, a gate electrode formedon the gate insulating layer and a spacer formed on side surfaces of thegate electrode.

In accordance with the fourth exemplary embodiment, transistors 410adjacent with each other may use the drain region 416 in common as shownin FIG. 8. Further, transistors 410 adjacent with each other may use aP-type high concentration impurity region 440 in common. Particularly, aP-type high concentration impurity region 440, which functions as asubstrate tab or a well tab, may be formed between the source regions414 of the transistors 410 adjacent with each other, and the adjacentsource regions 414 and the P-type high concentration impurity region 440may be electrically connected with one another. The P-type highconcentration impurity 440 connected with the adjacent source regions414 may be used to improve a breakdown voltage of the semiconductordevice 400.

The semiconductor device 400 may include a device isolation region 420configured to surround an active region on which the transistors 410 areformed. The device isolation region 420 may include a DTI region 422formed deeper than the DNW region 430 and a STI region 424 formed on theDTI region 422. The DNW region 430 and the LPW region 432 may be formedinside the device isolation region 420.

Meanwhile, a second PW region 434 may be formed outside the deviceisolation region 420, and a second P-type high concentration impurityregion 442 may be formed on the second PW region 434. The second P-typehigh concentration impurity region 442 may be used to apply a PW biasvoltage to the high resistivity substrate 402.

FIG. 9 is a cross-sectional view illustrating a semiconductor device inaccordance with a fifth exemplary embodiment of the claimed invention.

Referring to FIG. 9, a semiconductor device 500, in accordance with afifth exemplary embodiment, may include a plurality of transistors 510formed on a high resistivity substrate 502. Particularly, thesemiconductor device 500 may have a multi-finger structure in which thetransistors 510 are electrically connected with one another.

A DNW region 530 may be formed in the high resistivity substrate 502,and an LPW region 532 may be formed on the DNW region 530. Thetransistors 510 may be formed on the LPW region 532. Each of thetransistors 510 may include a gate structure 512 formed on the LPWregion 532 and source and drain regions 514 and 516 formed at surfaceportions of the LPW region 532 adjacent to both sides of the gatestructure 512, respectively. The gate structure 512 may include a gateinsulating layer formed on the LPW region 532, a gate electrode formedon the gate insulating layer and a spacer formed on side surfaces of thegate electrode.

In accordance with the fifth exemplary embodiment, transistors 510adjacent with each other may use the drain region 516 in common as shownin FIG. 9. Further, transistors 510 adjacent with each other may use aP-type high concentration impurity region 540 in common. Particularly, aP-type high concentration impurity region 540, which functions as asubstrate tab or a well tab, may be formed between the source regions514 of the transistors 510 adjacent with each other, and the adjacentsource regions 514 and the P-type high concentration impurity region 540may be electrically connected with one another.

The semiconductor device 500 may include a device isolation region 520configured to surround an active region on which the transistors 510 areformed. The device isolation region 520 may include a DTI region 522formed deeper than the DNW region 530 and a STI region 524 formed on theDTI region 522. An NW region 534 may be formed outside the deviceisolation region 520, and an N-type high concentration impurity region542 may be formed on the NW region 534.

Particularly, the LPW region 532 may be formed inside the deviceisolation region 520, and the DNW region 530 may be formed wider thanthe LPW region 532. The DTI region 522 may pass through the DNW region530 and extend deeper than the DNW region 530. The NW region 534 may beformed on an edge portion of the DNW region 530 to have a ring shape.

In accordance with the fifth exemplary embodiment, the NW region 534 maybe electrically connected with the edge portion of the DNW region 530,and the DTI region 522 may have a slit 526 to electrically connect theDNW region 530 with the NW region 534. The slit 526 may be used to applyan NW bias voltage or a reverse bias voltage to the DNW region 530through the N-type high concentration impurity region 542 and the NWregion 534. For example, a width of the slit 526 may be in a range ofabout 1 μm to about 2 μm.

Further, a second PW region 536 may be formed outside the NW region 534,and a second P-type high concentration impurity region 544 may be formedon the second PW region 536. The second P-type high concentrationimpurity region 544 may be used to apply a PW bias voltage to the highresistivity substrate 502, and the second PW region 536 may be used toreduce or prevent a depletion region from extending between the NWregion 534 and the high resistivity substrate 502. Still further, asecond STI region 550 may be formed between the N-type highconcentration impurity region 542 and the second P-type highconcentration impurity region 544.

FIG. 10 is a cross-sectional view illustrating a semiconductor device inaccordance with a sixth exemplary embodiment of the claimed invention.

Referring to FIG. 10, a semiconductor device 600, in accordance with asixth exemplary embodiment, may include a plurality of transistors 610formed on a high resistivity substrate 602. Particularly, thesemiconductor device 600 may have a multi-finger structure in which thetransistors 610 are electrically connected with one another.

A DNW region 630 may be formed in the high resistivity substrate 602,and an LPW region 632 may be formed on the DNW region 630. Thetransistors 610 may be formed on the LPW region 632. Each of thetransistors 610 may include a gate structure 612 formed on the LPWregion 632 and source and drain regions 614 and 616 formed at surfaceportions of the LPW region 632 adjacent to both sides of the gatestructure 612, respectively. The gate structure 612 may include a gateinsulating layer formed on the LPW region 632, a gate electrode formedon the gate insulating layer and a spacer formed on side surfaces of thegate electrode.

In accordance with the sixth exemplary embodiment, transistors 610adjacent with each other may use the drain region 616 in common as shownin FIG. 10. Further, transistors 610 adjacent with each other may use aP-type high concentration impurity region 640 in common. Particularly, aP-type high concentration impurity region 640, which functions as asubstrate tab or a well tab, may be formed between the source regions614 of the transistors 610 adjacent with each other, and the adjacentsource regions 614 and the P-type high concentration impurity region 640may be electrically connected with one another.

The semiconductor device 600 may include a first device isolation region620 configured to surround an active region on which the transistors 610are formed. The first device isolation region 620 may include a firstDTI region 622 formed deeper than the DNW region 630 and a first STIregion 624 formed on the first DTI region 622. An NW region 634 may beformed outside the first device isolation region 620, and an N-type highconcentration impurity region 642 may be formed on the NW region 634.

Particularly, the LPW region 632 may be formed inside the first deviceisolation region 620, and the DNW region 630 may be formed wider thanthe LPW region 632. The first DTI region 622 may pass through the DNWregion 630 and extend deeper than the DNW region 630. The NW region 634may be formed on an edge portion of the DNW region 630 to have a ringshape.

In accordance with the sixth exemplary embodiment, the NW region 634 maybe electrically connected with the edge portion of the DNW region 630,and the first DTI region 622 may have a slit 626 to electrically connectthe DNW region 630 with the NW region 634. The slit 626 may be used toapply an NW bias voltage or a reverse bias voltage to the DNW region 630through the N-type high concentration impurity region 642 and the NWregion 634. For example, a width of the slit 626 may be in a range ofabout 1 μm to about 2 μm.

Particularly, a second device isolation region 650 may be formed outsidethe NW region 634, which may have a ring shape to surround the NW region634 and the N-type high concentration impurity region 642. The seconddevice isolation region 650 may include a second DTI region 652 and asecond STI region 654 formed on the second DTI region 652. For example,a depth of the second DTI region 652 may be greater than about 5 μm.Particularly, a depth of the second DTI region 652 may be in a range ofabout 5 μm to about 10 μm.

The second device isolation region 650 may be used to reduce or preventa depletion region from extending between the DNW region 630, the NWregion 634 and the high resistivity substrate 602. Further, the seconddevice isolation region 650 may be used to electrically isolate thesemiconductor device 600 from a control device adjacent thereto.

Further, a second PW region 636 may be formed outside the second deviceisolation region 650, and a second P-type high concentration impurityregion 644 may be formed on the second PW region 636. The second P-typehigh concentration impurity region 644 may be used to apply a PW biasvoltage to the high resistivity substrate 602.

Meanwhile, the semiconductor devices, in accordance with some exemplaryembodiments of the claimed invention as described above, may be used asan RF switching device of an RF module such as an RF FEM.

FIG. 11 is a schematic view illustrating an RF module formed on a highresistivity substrate.

Referring to FIG. 11, an RF module 700, such as an RF FEM, may includean RF switching device 710, an RF active device 720, an RF passivedevice 730 and a control device 740, which may be formed on a highresistivity substrate 702. For example, the RF active device 720 mayinclude a power amplifier, and the RF passive device 730 may includepassive components such as capacitors, inductors, transformers, or thelike.

Particularly, the heat dissipation efficiency through the highresistivity substrate 702 may be significantly improved in comparisonwith the conventional SOI substrate. Thus, the performance of the RFactive device 720 and the electrical characteristics of the RF passivedevice 730 may be significantly improved.

In accordance with the exemplary embodiments of the claimed invention asdescribed above, a semiconductor device may include a high resistivitysubstrate, a transistor formed on the high resistivity substrate, and adevice isolation region formed in the high resistivity substrate tosurround the transistor. The device isolation region may include a DTIregion and a STI region formed on the DTI region. Further, thesemiconductor device may include a DNW region formed in the highresistivity substrate and an LPW region formed on the DNW region, andthe transistor may be formed on the LPW region.

As described above, because the semiconductor device may be manufacturedby using the high resistivity substrate, the manufacturing cost of thesemiconductor device may be significantly reduced in comparison with theconventional art using the SOI substrate. Further, the junctioncapacitance and the RF noise coupling of the semiconductor device may besignificantly reduced by the DTI region and the DNW region.

Particularly, depletion regions between the source and drain regions andthe LPW region may sufficiently extend, and thus the Coff and Ron of thesemiconductor device may be significantly reduced. As a result, the RFswitch performance of the semiconductor device may be significantlyimproved.

Still further, the DTI region may have a slit to apply an NW biasvoltage or a reverse bias voltage to the DNW region therethrough. Thus,a junction capacitance due to the DNW region may be significantlyreduced thereby significantly improving the electrical characteristicsof the RF switching device.

Although the semiconductor devices have been described with reference tothe specific embodiments, they are not limited thereto. Therefore, itwill be readily understood by those skilled in the art that variousmodifications and changes can be made thereto without departing from thespirit and scope of the appended claims.

Persons of ordinary skill in the relevant arts will recognize that theinvention may comprise fewer features than illustrated in any individualembodiment described above. The embodiments described herein are notmeant to be an exhaustive presentation of the ways in which the variousfeatures of the invention may be combined. Accordingly, the embodimentsare not mutually exclusive combinations of features; rather, theinvention can comprise a combination of different individual featuresselected from different individual embodiments, as understood by personsof ordinary skill in the art. Moreover, elements described with respectto one embodiment can be implemented in other embodiments even when notdescribed in such embodiments unless otherwise noted. Although adependent claim may refer in the claims to a specific combination withone or more other claims, other embodiments can also include acombination of the dependent claim with the subject matter of each otherdependent claim or a combination of one or more features with otherdependent or independent claims. Such combinations are proposed hereinunless it is stated that a specific combination is not intended.Furthermore, it is intended also to include features of a claim in anyother independent claim even if this claim is not directly madedependent to the independent claim.

Any incorporation by reference of documents above is limited such thatno subject matter is incorporated that is contrary to the explicitdisclosure herein. Any incorporation by reference of documents above isfurther limited such that no claims included in the documents areincorporated by reference herein. Any incorporation by reference ofdocuments above is yet further limited such that any definitionsprovided in the documents are not incorporated by reference hereinunless expressly included herein.

For purposes of interpreting the claims for the present invention, it isexpressly intended that the provisions of Section 112(f) of 35 U.S.C.are not to be invoked unless the specific terms “means for” or “stepfor” are recited in a claim.

What is claimed is:
 1. A semiconductor device comprising: a highresistivity substrate having a first conductive type; a deep well regionhaving a second conductive type and arranged in the high resistivitysubstrate; a low concentration well region having the first conductivetype and arranged on the deep well region; a transistor arranged on thelow concentration well region; a device isolation region arranged in thehigh resistivity substrate to surround the low concentration well regionand comprising a deep trench device isolation region and a shallowtrench device isolation region arranged on the deep trench deviceisolation region; a second well region having the second conductive typeand arranged to surround the device isolation region; a second deviceisolation region arranged to surround the second well region andcomprising a second deep trench device isolation region and a secondshallow trench device isolation region arranged on the second deeptrench device isolation region; and a third well region having the firstconductive type and arranged to surround the second device isolationregion, wherein the deep well region is arranged wider than the lowconcentration well region, and the deep trench device isolation regionextends through the deep well region so as to be deeper than the deepwell region and has a slit to electrically connect the deep well regionwith the second well region.
 2. The semiconductor device of claim 1,wherein the transistor comprises: a gate structure arranged on the lowconcentration well region; a source region and a drain region eacharranged at surface portions of the low concentration well region,wherein the source region and the drain region are arranged at oppositesides of the gate structure; and a high concentration impurity regionarranged on one side of the source region.
 3. The semiconductor deviceof claim 2, wherein the source region is of the second conductive type;the high concentration impurity region is of the first conductive type;and the source region and the high concentration impurity region areelectrically connected with each other.
 4. The semiconductor device ofclaim 1, wherein the low concentration well region has an impurityconcentration in a range of about 1E+10 to about 1E+12 ions/cm².
 5. Thesemiconductor device of claim 1, wherein a second high concentrationimpurity region having the second conductive type is arranged on thesecond well region.
 6. The semiconductor device of claim 1, wherein asurface portion of the high resistivity substrate is the lowconcentration well region.
 7. A semiconductor device comprising: a highresistivity substrate having a first conductive type; a deep well regionhaving a second conductive type and arranged in the high resistivitysubstrate; a low concentration well region having the first conductivetype and arranged on the deep well region; a plurality of transistorsarranged on the low concentration well region and disposed in amulti-finger structure in which the plurality of transistors iselectrically connected with one another; a device isolation regionhaving a ring shape to surround the low concentration well region andcomprising a deep trench device isolation region and a shallow trenchdevice isolation region arranged on the deep trench device isolationregion; a second well region having the second conductive type andarranged to surround the device isolation region; a second deviceisolation region arranged to surround the second well region andcomprising a second deep trench device isolation region and a secondshallow trench device isolation region arranged on the second deeptrench device isolation region; and a third well region having the firstconductive type and arranged to surround the second device isolationregion, wherein the deep well region is arranged wider than the lowconcentration well region, and the deep trench device isolation regionextends through the deep well region so as to be deeper than the deepwell region and has a slit to electrically connect the deep well regionwith the second well region.
 8. The semiconductor device of claim 7,wherein the low concentration well region has an impurity concentrationin a range of about 1E+10 to about 1E+12 ions/cm².
 9. The semiconductordevice of claim 7, wherein a high concentration impurity region havingthe first conductive type is arranged between source regions oftransistors disposed adjacent with each other among the plurality oftransistors; and the high concentration impurity region and the sourceregions of the adjacent transistors are electrically connected with oneanother.
 10. The semiconductor device of claim 7, wherein a second highconcentration impurity region having the second conductive type isarranged on the second well region.
 11. The semiconductor device ofclaim 10, wherein a third high concentration impurity region having thefirst conductive type is arranged on the third well region.
 12. A radiofrequency (RF) module comprising: an RF switching device arranged on ahigh resistivity substrate; an RF active device arranged on the highresistivity substrate; an RF passive device arranged on the highresistivity substrate; and a control device arranged on the highresistivity substrate, wherein the RF switching device comprises: a deepwell region having a second conductive type and arranged in the highresistivity substrate; a low concentration well region having a firstconductive type and arranged on the deep well region; a transistorarranged on the low concentration well region; a device isolation regionarranged in the high resistivity substrate to surround the lowconcentration well region and comprising a deep trench device isolationregion and a shallow trench device isolation region arranged on the deeptrench device isolation region; a second well region having the secondconductive type and arranged to surround the device isolation region; asecond device isolation region arranged to surround the second wellregion and comprising a second deep trench device isolation region and asecond shallow trench device isolation region arranged on the seconddeep trench device isolation region; and a third well region having thefirst conductive type and arranged to surround the second deviceisolation region, wherein the deep well region is arranged wider thanthe low concentration well region, and the deep trench device isolationregion extends through the deep well region so as to be deeper than thedeep well region and has a slit to electrically connect the deep wellregion with the second well region.